Aluminum Nitride

Product description

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AlN has excellent thermal conductivity, is thus considered as high performance electronic packaging material.


Leatec offers a series of substrates based on AlN materials for use in application environments.

These materials are available in both lapped and “as fired” condition as well as metalized and non-metalized substrates.

 

Applications

Power modulus, IGBT, MOSFET,..

High power LED package

LED chip substrate

Contact details

Leatec Fine Ceramics Co., Ltd.

No. 160, Sec. 1, Pingdong Road, Pingzhen District
32473 Taoyuan
Taiwan

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Part No.

Thermal  Conductivity

(W/m-k)

Dimension L*W(inch)

Thickness (mm)

 

AN4545-10AA

170

4.5”* 4.5”

0.25

 

AN4747-14AA

170

4.75”* 4.75”

0.36

 

AN4545-20AA

170

4.5”* 4.5”

0.5

 

AN7555-15AA

170

7.5”* 5.5”

0.38

 

AN7555-25AA

170

7.5”* 5.5”

0.635

 

AN80-40AA

170

Φ8”

1.0

 

AN4747-10DA

150

4.75”* 4.75”

0.25

 

AN4747-14DA

150

4.75”* 4.75”

0.36

 

AN4747-20DA

150

4.75”* 4.75”

0.50

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